Sistem pengukuran

Leica EM TXP

The EM TXP is a unique device developed for the precise preparation of a wide range of materials and material composites exhibiting localized, minute defects. It is specifically designed for sawing, milling, grinding, and polishing of demanding, small, and unwieldy samples, where the work process is observed via a stereomicroscope and a final examination using a scanning electron microscope or light microscope can be performed without interrupting the individual working steps.

The EM TXP is particularly well suited for pre-preparation of materials that are to undergo bevel cutting with an ion polishing system.

Supplied with the following accessories:
1 pc. Stereomicroscope M80 complete
1 pc. Crosshair stage for M80, 12 mm
1 pc. Movable objective adapter for M80
1 pc. Angle adjustment adapter
1 pc. Diamond saw blade
1 pc. Diamond saw blade
1 pc. Special milling cutter with 6 mm Ø diamond cutting edge
1 pc. Special milling cutter with 12 mm Ø diamond cutting edge
1 pc. Special milling cutter with 8 mm Ø tungsten carbide cutter
1 pc. Special milling cutter with 12 mm Ø tungsten carbide cutter
5 pcs. Mandrels
3 pcs. Carrier discs for lapping foil
1 pc. Lapping foil 15µm, SiC, Ø 30 mm
1 pc. Lapping foil 9µm, SiC, Ø 30 mm
1 pc. Lapping foil 5µm, SiC, Ø 30 mm
3 pcs. Carrier discs for lapping foil
1 pc. Lapping foil 9µm, diamond (type U)
1 pc. Lapping foil 2µm, diamond (type U)
1 pc. Lapping foil 0.5µm, diamond (type U)
1 pc. Lapping foil 0.1µm, diamond (type LA)
3 pcs. Carrier discs for lapping foil
1 pc. Lapping foil 9µm, aluminium oxide
Fjdpeytrwajfx Aagspd
1 pc. Lapping foil 3µm, aluminium oxide
1 pc. Lapping foil 1µm, aluminium oxide
1 pc. Lapping foil 0.3µm, aluminium oxide
1 pc. Neoprene polishing cloth for final polishing (8 pieces)
2 pcs. Box for carriers and foils
1 pc. Holder for flat samples 0–4 mm
1 pc. Flat sample holder 3–8 mm
1 pc. TXP SEM stub holder
1 pc. Universal sample holder

Iklan ini diterjemahkan secara otomatis. Kesalahan terjemahan mungkin terjadi.